The U.S. Department of Energy (DOE) has announced a funding initiative totaling $179 million for three Microelectronics Science Research Centers (MSRCs). These centers are set to conduct foundational research in microelectronics, focusing on materials, device and system design, and manufacturing science. The objective is to transform future technologies in the field.
This funding was authorized by the Micro Act, which was part of the CHIPS and Science Act of 2022. The act aims to complement efforts already underway at various governmental departments including Commerce and Defense.
DOE has historically been a leader in microelectronics, contributing significantly to scientific understanding that has driven industry innovations. With emerging computing needs and expanding data volumes, there is an increasing demand for redesigning microelectronics materials and processes. This includes developing energy-efficient microelectronics capable of operating under extreme conditions such as high radiation or cryogenic temperatures.
“Advancements in microelectronics are critical to furthering scientific discovery,” stated Harriet Kung, Deputy Director for Science Programs at DOE's Office of Science. She added that these research centers will enhance daily life while advancing U.S. leadership in science and technology.
The three newly funded MSRCs include:
1. The Microelectronics Energy Efficiency Research Center for Advanced Technologies (MEERCAT), which focuses on revolutionizing energy-efficient microelectronics through integrated innovations across various domains including intelligent sensing and advanced computing.
2. The Co-design and Heterogeneous Integration in Microelectronics for Extreme Environments (CHIME) Center aims to make significant advancements in electronics designed for extreme environments by integrating diverse materials and technologies into next-generation systems.
3. The Extreme Lithography & Materials Innovation Center (ELMIC) will concentrate on advancing fundamental science related to new materials integration into future microelectronic systems, with a focus on areas like plasma-based nanofabrication and extreme-scale memory.
These centers consist of networks comprising 16 projects led by 10 national laboratories, selected through competitive peer review under the DOE Laboratory Announcement “Microelectronics Science Research Center Projects for Energy Efficiency and Extreme Environments.”